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Tom Rini53633a82024-02-29 12:33:36 -05001# SPDX-License-Identifier: (GPL-2.0)
2# Copyright 2020 Linaro Ltd.
3%YAML 1.2
4---
5$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml#
6$schema: http://devicetree.org/meta-schemas/base.yaml#
7
8title: Thermal zone
9
10maintainers:
11 - Daniel Lezcano <daniel.lezcano@linaro.org>
12
13description: |
14 Thermal management is achieved in devicetree by describing the sensor hardware
15 and the software abstraction of cooling devices and thermal zones required to
16 take appropriate action to mitigate thermal overloads.
17
18 The following node types are used to completely describe a thermal management
19 system in devicetree:
20 - thermal-sensor: device that measures temperature, has SoC-specific bindings
21 - cooling-device: device used to dissipate heat either passively or actively
22 - thermal-zones: a container of the following node types used to describe all
23 thermal data for the platform
24
25 This binding describes the thermal-zones.
26
27 The polling-delay properties of a thermal-zone are bound to the maximum dT/dt
28 (temperature derivative over time) in two situations for a thermal zone:
29 1. when passive cooling is activated (polling-delay-passive)
30 2. when the zone just needs to be monitored (polling-delay) or when
31 active cooling is activated.
32
33 The maximum dT/dt is highly bound to hardware power consumption and
34 dissipation capability. The delays should be chosen to account for said
35 max dT/dt, such that a device does not cross several trip boundaries
36 unexpectedly between polls. Choosing the right polling delays shall avoid
37 having the device in temperature ranges that may damage the silicon structures
38 and reduce silicon lifetime.
39
40properties:
41 $nodename:
42 const: thermal-zones
43 description:
44 A /thermal-zones node is required in order to use the thermal framework to
45 manage input from the various thermal zones in the system in order to
46 mitigate thermal overload conditions. It does not represent a real device
47 in the system, but acts as a container to link a thermal sensor device,
48 platform-data regarding temperature thresholds and the mitigation actions
49 to take when the temperature crosses those thresholds.
50
51patternProperties:
52 "^[a-zA-Z][a-zA-Z0-9\\-]{1,12}-thermal$":
53 type: object
54 description:
55 Each thermal zone node contains information about how frequently it
56 must be checked, the sensor responsible for reporting temperature for
57 this zone, one sub-node containing the various trip points for this
58 zone and one sub-node containing all the zone cooling-maps.
59
60 properties:
61 polling-delay:
62 $ref: /schemas/types.yaml#/definitions/uint32
63 description:
64 The maximum number of milliseconds to wait between polls when
65 checking this thermal zone. Setting this to 0 disables the polling
66 timers setup by the thermal framework and assumes that the thermal
67 sensors in this zone support interrupts.
68
69 polling-delay-passive:
70 $ref: /schemas/types.yaml#/definitions/uint32
71 description:
72 The maximum number of milliseconds to wait between polls when
73 checking this thermal zone while doing passive cooling. Setting
74 this to 0 disables the polling timers setup by the thermal
75 framework and assumes that the thermal sensors in this zone
76 support interrupts.
77
Tom Rini93743d22024-04-01 09:08:13 -040078 critical-action:
79 $ref: /schemas/types.yaml#/definitions/string
80 description: |
81 The action the OS should perform after the critical temperature is reached.
82 By default the system will shutdown as a safe action to prevent damage
83 to the hardware, if the property is not set.
84 The shutdown action should be always the default and preferred one.
85 Choose 'reboot' with care, as the hardware may be in thermal stress,
86 thus leading to infinite reboots that may cause damage to the hardware.
87 Make sure the firmware/bootloader will act as the last resort and take
88 over the thermal control.
89
90 enum:
91 - shutdown
92 - reboot
93
Tom Rini53633a82024-02-29 12:33:36 -050094 thermal-sensors:
95 $ref: /schemas/types.yaml#/definitions/phandle-array
96 maxItems: 1
97 description:
98 The thermal sensor phandle and sensor specifier used to monitor this
99 thermal zone.
100
101 coefficients:
102 $ref: /schemas/types.yaml#/definitions/uint32-array
103 description:
104 An array of integers containing the coefficients of a linear equation
105 that binds all the sensors listed in this thermal zone.
106
107 The linear equation used is as follows,
108 z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn
109 where c0, c1, .., cn are the coefficients.
110
111 Coefficients default to 1 in case this property is not specified. The
112 coefficients are ordered and are matched with sensors by means of the
113 sensor ID. Additional coefficients are interpreted as constant offset.
114
115 sustainable-power:
116 $ref: /schemas/types.yaml#/definitions/uint32
117 description:
118 An estimate of the sustainable power (in mW) that this thermal zone
119 can dissipate at the desired control temperature. For reference, the
120 sustainable power of a 4-inch phone is typically 2000mW, while on a
121 10-inch tablet is around 4500mW.
122
123 trips:
124 type: object
125 description:
126 This node describes a set of points in the temperature domain at
127 which the thermal framework needs to take action. The actions to
128 be taken are defined in another node called cooling-maps.
129
130 patternProperties:
131 "^[a-zA-Z][a-zA-Z0-9\\-_]{0,63}$":
132 type: object
133
134 properties:
135 temperature:
136 $ref: /schemas/types.yaml#/definitions/int32
137 minimum: -273000
138 maximum: 200000
139 description:
140 An integer expressing the trip temperature in millicelsius.
141
142 hysteresis:
143 $ref: /schemas/types.yaml#/definitions/uint32
144 description:
145 An unsigned integer expressing the hysteresis delta with
146 respect to the trip temperature property above, also in
147 millicelsius. Any cooling action initiated by the framework is
148 maintained until the temperature falls below
149 (trip temperature - hysteresis). This potentially prevents a
150 situation where the trip gets constantly triggered soon after
151 cooling action is removed.
152
153 type:
154 $ref: /schemas/types.yaml#/definitions/string
155 enum:
156 - active # enable active cooling e.g. fans
157 - passive # enable passive cooling e.g. throttling cpu
158 - hot # send notification to driver
159 - critical # send notification to driver, trigger shutdown
160 description: |
161 There are four valid trip types: active, passive, hot,
162 critical.
163
164 The critical trip type is used to set the maximum
165 temperature threshold above which the HW becomes
166 unstable and underlying firmware might even trigger a
167 reboot. Hitting the critical threshold triggers a system
168 shutdown.
169
170 The hot trip type can be used to send a notification to
171 the thermal driver (if a .notify callback is registered).
172 The action to be taken is left to the driver.
173
174 The passive trip type can be used to slow down HW e.g. run
175 the CPU, GPU, bus at a lower frequency.
176
177 The active trip type can be used to control other HW to
178 help in cooling e.g. fans can be sped up or slowed down
179
180 required:
181 - temperature
182 - hysteresis
183 - type
184 additionalProperties: false
185
186 additionalProperties: false
187
188 cooling-maps:
189 type: object
190 additionalProperties: false
191 description:
192 This node describes the action to be taken when a thermal zone
193 crosses one of the temperature thresholds described in the trips
194 node. The action takes the form of a mapping relation between a
195 trip and the target cooling device state.
196
197 patternProperties:
198 "^map[-a-zA-Z0-9]*$":
199 type: object
200
201 properties:
202 trip:
203 $ref: /schemas/types.yaml#/definitions/phandle
204 description:
205 A phandle of a trip point node within this thermal zone.
206
207 cooling-device:
208 $ref: /schemas/types.yaml#/definitions/phandle-array
209 description:
210 A list of cooling device phandles along with the minimum
211 and maximum cooling state specifiers for each cooling
212 device. Using the THERMAL_NO_LIMIT (-1UL) constant in the
213 cooling-device phandle limit specifier lets the framework
214 use the minimum and maximum cooling state for that cooling
215 device automatically.
216
217 contribution:
218 $ref: /schemas/types.yaml#/definitions/uint32
219 description:
220 The cooling contribution to the thermal zone of the referred
221 cooling device at the referred trip point. The contribution is
222 a ratio of the sum of all cooling contributions within a
223 thermal zone.
224
225 required:
226 - trip
227 - cooling-device
228 additionalProperties: false
229
230 required:
Tom Rini53633a82024-02-29 12:33:36 -0500231 - thermal-sensors
232 - trips
233
234 additionalProperties: false
235
236additionalProperties: false
237
238examples:
239 - |
240 #include <dt-bindings/interrupt-controller/arm-gic.h>
241 #include <dt-bindings/thermal/thermal.h>
242
243 // Example 1: SDM845 TSENS
244 soc {
245 #address-cells = <2>;
246 #size-cells = <2>;
247
248 /* ... */
249
250 tsens0: thermal-sensor@c263000 {
251 compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
252 reg = <0 0x0c263000 0 0x1ff>, /* TM */
253 <0 0x0c222000 0 0x1ff>; /* SROT */
254 #qcom,sensors = <13>;
255 interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>,
256 <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>;
257 interrupt-names = "uplow", "critical";
258 #thermal-sensor-cells = <1>;
259 };
260
261 tsens1: thermal-sensor@c265000 {
262 compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
263 reg = <0 0x0c265000 0 0x1ff>, /* TM */
264 <0 0x0c223000 0 0x1ff>; /* SROT */
265 #qcom,sensors = <8>;
266 interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>,
267 <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>;
268 interrupt-names = "uplow", "critical";
269 #thermal-sensor-cells = <1>;
270 };
271 };
272
273 /* ... */
274
275 thermal-zones {
276 cpu0-thermal {
277 polling-delay-passive = <250>;
278 polling-delay = <1000>;
279
280 thermal-sensors = <&tsens0 1>;
281
282 trips {
283 cpu0_alert0: trip-point0 {
284 temperature = <90000>;
285 hysteresis = <2000>;
286 type = "passive";
287 };
288
289 cpu0_alert1: trip-point1 {
290 temperature = <95000>;
291 hysteresis = <2000>;
292 type = "passive";
293 };
294
295 cpu0_crit: cpu_crit {
296 temperature = <110000>;
297 hysteresis = <1000>;
298 type = "critical";
299 };
300 };
301
302 cooling-maps {
303 map0 {
304 trip = <&cpu0_alert0>;
305 /* Corresponds to 1400MHz in OPP table */
306 cooling-device = <&CPU0 3 3>, <&CPU1 3 3>,
307 <&CPU2 3 3>, <&CPU3 3 3>;
308 };
309
310 map1 {
311 trip = <&cpu0_alert1>;
312 /* Corresponds to 1000MHz in OPP table */
313 cooling-device = <&CPU0 5 5>, <&CPU1 5 5>,
314 <&CPU2 5 5>, <&CPU3 5 5>;
315 };
316 };
317 };
318
319 /* ... */
320
321 cluster0-thermal {
322 polling-delay-passive = <250>;
323 polling-delay = <1000>;
324
325 thermal-sensors = <&tsens0 5>;
326
327 trips {
328 cluster0_alert0: trip-point0 {
329 temperature = <90000>;
330 hysteresis = <2000>;
331 type = "hot";
332 };
333 cluster0_crit: cluster0_crit {
334 temperature = <110000>;
335 hysteresis = <2000>;
336 type = "critical";
337 };
338 };
339 };
340
341 /* ... */
342
343 gpu-top-thermal {
344 polling-delay-passive = <250>;
345 polling-delay = <1000>;
346
347 thermal-sensors = <&tsens0 11>;
348
349 trips {
350 gpu1_alert0: trip-point0 {
351 temperature = <90000>;
352 hysteresis = <2000>;
353 type = "hot";
354 };
355 };
356 };
357 };
358...