blob: 326efa0a2d6d86c1a7e803ae9b4f1e8a182ac75d [file] [log] [blame]
Sandeep Paulraj49ea9a02009-11-21 13:13:59 -05001Summary
2=======
3
Bartosz Golaszewski8856cb22019-04-30 09:39:25 +02004Note: this document used to be about the entire family of DaVinci SOCs but the
5support for the DM* family and DA830 has since been dropped.
Sandeep Paulraj49ea9a02009-11-21 13:13:59 -05006
Bartosz Golaszewski8856cb22019-04-30 09:39:25 +02007This README is about U-Boot support for TI's DA850 SoC. This SOC has an OMAP
8part number but is very similar to the DaVinci series.
Sandeep Paulraj49ea9a02009-11-21 13:13:59 -05009
Bartosz Golaszewski8856cb22019-04-30 09:39:25 +020010Currently the following boards are supported:
Sandeep Paulraj49ea9a02009-11-21 13:13:59 -050011
Sekhar Noriab746452010-11-19 11:39:46 -050012* TI DA850 EVM
13
Bartosz Golaszewski8856cb22019-04-30 09:39:25 +020014* TI OMAP-L138 LCDK
Sandeep Paulraj49ea9a02009-11-21 13:13:59 -050015
Bartosz Golaszewski8856cb22019-04-30 09:39:25 +020016* Lego EV3
Sandeep Paulraj49ea9a02009-11-21 13:13:59 -050017
18Build
19=====
20
Sekhar Noriab746452010-11-19 11:39:46 -050021* TI DA850 EVM:
22
23make da850evm_config
24make
25
Bartosz Golaszewski8856cb22019-04-30 09:39:25 +020026* TI OMAP-L138 LCDK
Sandeep Paulraj49ea9a02009-11-21 13:13:59 -050027
Bartosz Golaszewski8856cb22019-04-30 09:39:25 +020028make omapl138_lcdk_defconfig
Sandeep Paulraj49ea9a02009-11-21 13:13:59 -050029make
30
Bartosz Golaszewski8856cb22019-04-30 09:39:25 +020031* Lego EV3
Sandeep Paulraj49ea9a02009-11-21 13:13:59 -050032
Bartosz Golaszewski8856cb22019-04-30 09:39:25 +020033make legoev3_defconfig
Sandeep Paulraj49ea9a02009-11-21 13:13:59 -050034make
35
36Bootloaders
37===============
38
Bartosz Golaszewski8856cb22019-04-30 09:39:25 +020039For DA850 an SPL (secondary program loader, see doc/README.SPL) is provided
Adam Ford8ddb6172020-06-29 18:32:02 -050040to load U-Boot from SPI flash, MMC or NAND. The SPL takes care of the low level
Bartosz Golaszewski8856cb22019-04-30 09:39:25 +020041initialization.
Sandeep Paulraj49ea9a02009-11-21 13:13:59 -050042
Adam Ford8ddb6172020-06-29 18:32:02 -050043The SPL is built as u-boot.ais for all DA850 defconfigs except those booting
44from NOR flash. The resulting image file can be programmed to the SPI flash
45of the DA850 EVM/LCDK.
46
47Devices that support booting from NOR utilize execute in place (XIP) and do
48not require SPL to perform low level initialization.
Christian Riesch63e341b2011-12-09 09:47:37 +000049
Sekhar Nori6e112202010-11-19 11:39:48 -050050Environment Variables
51=====================
52
53The DA850 EVM allows the user to specify the maximum cpu clock allowed by the
54silicon, in Hz, via an environment variable "maxcpuclk".
55
56The maximum clock rate allowed depends on the silicon populated on the EVM.
57Please make sure you understand the restrictions placed on this clock in the
58device specific datasheet before setting up this variable. This information is
59passed to the Linux kernel using the ATAG_REVISION atag.
60
61If "maxcpuclk" is not defined, the configuration CONFIG_DA850_EVM_MAX_CPU_CLK
62is used to obtain this information.
63
Sandeep Paulraj49ea9a02009-11-21 13:13:59 -050064Links
65=====
66
Bartosz Golaszewski8856cb22019-04-30 09:39:25 +0200671) TI DA850 EVM
Sekhar Noriab746452010-11-19 11:39:46 -050068http://focus.ti.com/docs/prod/folders/print/omap-l138.html
69http://www.logicpd.com/products/development-kits/zoom-omap-l138-evm-development-kit
Heiko Schocherf49e9442011-09-14 19:59:37 +000070
Bartosz Golaszewski8856cb22019-04-30 09:39:25 +0200712) TI OMAP-L138 LCDK
72http://focus.ti.com/docs/prod/folders/print/omap-l138.html
73http://www.ti.com/tool/TMDXLCDK138
74
Heiko Schocherf49e9442011-09-14 19:59:37 +000075Davinci special defines
76=======================
77
Tom Rini6a5dccc2022-11-16 13:10:41 -050078CFG_SYS_DV_NOR_BOOT_CFG: AM18xx based boards, booting in NOR Boot mode
Heiko Schocherf49e9442011-09-14 19:59:37 +000079 need a "NOR Boot Configuration Word" stored
80 in the NOR Flash. This define adds this.
81 More Info about this, see:
82 spraba5a.pdf chapter 3.1