arm: omap5: add U-Boot FIT signing and SPL image post-processing
Modify the SPL build procedure for AM57xx and DRA7xx high-security (HS)
device variants to create a secure u-boot_HS.img FIT blob that contains
U-Boot and DTB artifacts signed with a TI-specific process based on the
CONFIG_TI_SECURE_DEVICE config option and the externally-provided image
signing tool.
Also populate the corresponding FIT image post processing call to be
performed during SPL runtime.
Signed-off-by: Daniel Allred <d-allred@ti.com>
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
diff --git a/board/ti/am57xx/board.c b/board/ti/am57xx/board.c
index 08cf14d..927d136 100644
--- a/board/ti/am57xx/board.c
+++ b/board/ti/am57xx/board.c
@@ -13,6 +13,7 @@
#include <sata.h>
#include <usb.h>
#include <asm/omap_common.h>
+#include <asm/omap_sec_common.h>
#include <asm/emif.h>
#include <asm/gpio.h>
#include <asm/arch/gpio.h>
@@ -750,3 +751,10 @@
return -1;
}
#endif
+
+#ifdef CONFIG_TI_SECURE_DEVICE
+void board_fit_image_post_process(void **p_image, size_t *p_size)
+{
+ secure_boot_verify_image(p_image, p_size);
+}
+#endif